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  •   Automatic double-sided lithography machine MA-4200 series

    *2/4/6'' wafer compatible
    *EAP/SCES GEM Correspondence
  •   Automatic double-sided lithography machine MA-4300 series

    *6/8" compatible
    *High-speed and stable fully automatic operation
  •   Automatic double-sided lithography machine MA-5301 series

    *6" / 8" / 12" compatible (smif / foup correspondence)
    *High-speed and stable fully automatic operation
  •   Manual lithography machine DA-1000 series

    *Manual single-sided exposure machine for experimental research on substrates such as glass, Wafer, and film.
    *Compatible with wafer up to 4" and fragments
  •   Semi-automatic lithography machine MA-1000 series

    *Compatible with 8" 6" 4" pieces
  •   Ambient temperature bonding machine

    ★ The same bonding strength as the base material can be obtained at room temperature (room temperature) bonding process ★ No thermal distortion/thermal stress during bonding
  •   Ambient temperature bonding machine

    ★ The same bond strength as the base material can be obtained at room temperature (room temperature) bonding process ★ No thermal deformation/thermal stress during bonding
  •   EBL Electron Beam Direct Tracer 9500

  •   EBL Electron Beam Direct Stroke Machine 8100

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