★ The same bond strength as the base material can be obtained at room temperature (room temperature) bonding process
★ No thermal deformation/thermal stress during bonding
- Device quality is very stable
- Easy to cope with microfabrication process
★ No heating/cooling time required No annealing required
- Highly efficient production
Wide range of bonding materials available
- Silicon materials, metal materials, compound semiconductor materials, optical materials, and
Oxide monocrystalline materials, etc. can be bonded
- Bonding between dissimilar materials is possible
